Perforated fused silica glass wafer

Fused silica glass disc with holes is a special type of quartz glass, which has microporous structure. This material has applications in multiple fields, mainly due to its unique physical and chemical properties.

Material characteristics: fused silica discs with holes are mainly made of fused silica, and fused silica is a high-purity silica material. This material has the following characteristics:

Density: Approximately 2.203g/cm ⊃3;.

Working temperature: able to withstand high temperatures up to 1100 ℃.

Surface treatment: Typically, the surface is polished or frosted to enhance its optical and usability properties.

Application field: Porous fused silica wafer has been used in many industries due to its special structure and high purity, such as:

Optical applications: can be used as raw materials for windows, viewports, substrates, or more complex optical components.

Semiconductor applications: used for manufacturing batch processing equipment and single wafer processing equipment.

Medical equipment and chemical instruments: used in situations where high temperature resistance and corrosion resistance are required.

Other industrial applications: such as chemical, electronic, metallurgical, building materials, and national defense.

Performance characteristics: This quartz disc has the following performance characteristics:

High temperature resistance: able to withstand high temperature environments.

Low coefficient of expansion: Good thermal stability, adaptable to temperature changes.

Chemical stability: It has the ability to resist most chemical substances.

Electrical insulation performance: Good electrical insulation performance.

Perforated fused silica glass wafer is a kind of high-performance material, which is widely used in occasions where high purity, high stability and special physical and chemical properties are required.