Perforated fused silica glass wafer
Fused silica glass disc with holes is a special type of quartz glass, which has microporous structure.
LUVERRE quartz
99.99%
Inner with Vacuum PVC bag and then wrapped with air bubble film, outer with wooden box.
as per customer's requirement
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Perforated fused silica glass wafer
Fused silica glass disc with holes is a special type of quartz glass, which has microporous structure. This material has applications in multiple fields, mainly due to its unique physical and chemical properties.
Material characteristics: fused silica discs with holes are mainly made of fused silica, and fused silica is a high-purity silica material. This material has the following characteristics:
Density: Approximately 2.203g/cm ⊃3;.
Working temperature: able to withstand high temperatures up to 1100 ℃.
Surface treatment: Typically, the surface is polished or frosted to enhance its optical and usability properties.
Application field: Porous fused silica wafer has been used in many industries due to its special structure and high purity, such as:
Optical applications: can be used as raw materials for windows, viewports, substrates, or more complex optical components.
Semiconductor applications: used for manufacturing batch processing equipment and single wafer processing equipment.
Medical equipment and chemical instruments: used in situations where high temperature resistance and corrosion resistance are required.
Other industrial applications: such as chemical, electronic, metallurgical, building materials, and national defense.
Performance characteristics: This quartz disc has the following performance characteristics:
High temperature resistance: able to withstand high temperature environments.
Low coefficient of expansion: Good thermal stability, adaptable to temperature changes.
Chemical stability: It has the ability to resist most chemical substances.
Electrical insulation performance: Good electrical insulation performance.
Perforated fused silica glass wafer is a kind of high-performance material, which is widely used in occasions where high purity, high stability and special physical and chemical properties are required.
Perforated fused silica glass wafer
Fused silica glass disc with holes is a special type of quartz glass, which has microporous structure. This material has applications in multiple fields, mainly due to its unique physical and chemical properties.
Material characteristics: fused silica discs with holes are mainly made of fused silica, and fused silica is a high-purity silica material. This material has the following characteristics:
Density: Approximately 2.203g/cm ⊃3;.
Working temperature: able to withstand high temperatures up to 1100 ℃.
Surface treatment: Typically, the surface is polished or frosted to enhance its optical and usability properties.
Application field: Porous fused silica wafer has been used in many industries due to its special structure and high purity, such as:
Optical applications: can be used as raw materials for windows, viewports, substrates, or more complex optical components.
Semiconductor applications: used for manufacturing batch processing equipment and single wafer processing equipment.
Medical equipment and chemical instruments: used in situations where high temperature resistance and corrosion resistance are required.
Other industrial applications: such as chemical, electronic, metallurgical, building materials, and national defense.
Performance characteristics: This quartz disc has the following performance characteristics:
High temperature resistance: able to withstand high temperature environments.
Low coefficient of expansion: Good thermal stability, adaptable to temperature changes.
Chemical stability: It has the ability to resist most chemical substances.
Electrical insulation performance: Good electrical insulation performance.
Perforated fused silica glass wafer is a kind of high-performance material, which is widely used in occasions where high purity, high stability and special physical and chemical properties are required.