Fused silica glass plate for semiconductor equipment
Fused silica glass plate for semiconductor equipment is a kind of material specially designed for semiconductor manufacturing industry.
LUVERRE quartz
99.99%
Inner with Vacuum PVC bag and then wrapped with air bubble film, outer with wooden box.
as per customer's requirement
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Fused silica glass plate for semiconductor equipment
Fused silica glass plate for semiconductor equipment is a kind of material specially designed for semiconductor manufacturing industry. it has a series of unique physical and chemical characteristics, which makes it play a key role in semiconductor equipment.
The fused silica glass plate of semiconductor equipment is a high-purity quartz glass material, mainly composed of silicon dioxide (SiO2), which is made by special melting and cooling processes. It is widely used in semiconductor manufacturing processes, especially in environments that require high purity, high temperature resistance, and chemical stability.
High purity: fused silica glass plate is made of high-purity silicon dioxide, with extremely low impurity content, which is critical to the cleanliness and performance of semiconductor equipment.
High temperature resistance: This glass plate can withstand temperatures up to 1000 ° C or higher, making it suitable for high-temperature processes in semiconductor manufacturing such as wafer annealing, diffusion, and etching.
Low coefficient of thermal expansion: fused silica glass plate has a very low coefficient of thermal expansion, which means that its size changes very little when the temperature changes, which is crucial to maintaining the accuracy of semiconductor technology.
Chemical stability: It has high resistance to most chemical substances, is not easily corroded, and is suitable for various chemical processing environments in semiconductor manufacturing.
Optical transparency: fused silica glass plate has good transparency in the visible light and part of the ultraviolet light range, which is suitable for optical detection and laser processing.
Electrical insulation: This type of glass plate is a good electrical insulator, suitable for semiconductor equipment components that require electrical insulation.
Mechanical strength: Although the quartz glass is relatively brittle, the fused silica glass plate has good mechanical strength, which can meet the requirements of semiconductor equipment for material strength.
Application areas:
Wafer Carrier: Used as a wafer carrier or wafer boat for high-temperature processes such as annealing, diffusion, and CVD deposition.
Optical window: As an optical window material, it is used for laser processing, optical detection, and spectral analysis.
Reaction chamber components: used to manufacture walls and cover plates for etching and deposition reaction chambers, due to their high temperature resistance and chemical stability.
Isolator: Used as an isolator in semiconductor equipment to prevent cross contamination between different process areas.
The fused silica glass plate of semiconductor equipment plays an important role in the semiconductor manufacturing industry because of its excellent performance, helping to realize the production of high-precision and high reliability semiconductor devices.
Why choose us?
1.We are more experienced.
We have over 18 years production experience of quartz items.
2.We are more efficient.
We reply customers’ requests within 24 hours and we have high efficient production, engineers and sales team.
3.Our quality is more guaranteed.
We control the quality from quartz lumps to quartz sand and then quartz products, we have better and stricter quality control than other manufactures.
4.We are able to produce more difficult quartz products.
We have large grinding platforms and precision etching machines which enable us to produce large sizes of quartz plates, tubes and high size precision quartz items.
Fused silica glass plate for semiconductor equipment
Fused silica glass plate for semiconductor equipment is a kind of material specially designed for semiconductor manufacturing industry. it has a series of unique physical and chemical characteristics, which makes it play a key role in semiconductor equipment.
The fused silica glass plate of semiconductor equipment is a high-purity quartz glass material, mainly composed of silicon dioxide (SiO2), which is made by special melting and cooling processes. It is widely used in semiconductor manufacturing processes, especially in environments that require high purity, high temperature resistance, and chemical stability.
High purity: fused silica glass plate is made of high-purity silicon dioxide, with extremely low impurity content, which is critical to the cleanliness and performance of semiconductor equipment.
High temperature resistance: This glass plate can withstand temperatures up to 1000 ° C or higher, making it suitable for high-temperature processes in semiconductor manufacturing such as wafer annealing, diffusion, and etching.
Low coefficient of thermal expansion: fused silica glass plate has a very low coefficient of thermal expansion, which means that its size changes very little when the temperature changes, which is crucial to maintaining the accuracy of semiconductor technology.
Chemical stability: It has high resistance to most chemical substances, is not easily corroded, and is suitable for various chemical processing environments in semiconductor manufacturing.
Optical transparency: fused silica glass plate has good transparency in the visible light and part of the ultraviolet light range, which is suitable for optical detection and laser processing.
Electrical insulation: This type of glass plate is a good electrical insulator, suitable for semiconductor equipment components that require electrical insulation.
Mechanical strength: Although the quartz glass is relatively brittle, the fused silica glass plate has good mechanical strength, which can meet the requirements of semiconductor equipment for material strength.
Application areas:
Wafer Carrier: Used as a wafer carrier or wafer boat for high-temperature processes such as annealing, diffusion, and CVD deposition.
Optical window: As an optical window material, it is used for laser processing, optical detection, and spectral analysis.
Reaction chamber components: used to manufacture walls and cover plates for etching and deposition reaction chambers, due to their high temperature resistance and chemical stability.
Isolator: Used as an isolator in semiconductor equipment to prevent cross contamination between different process areas.
The fused silica glass plate of semiconductor equipment plays an important role in the semiconductor manufacturing industry because of its excellent performance, helping to realize the production of high-precision and high reliability semiconductor devices.
Why choose us?
1.We are more experienced.
We have over 18 years production experience of quartz items.
2.We are more efficient.
We reply customers’ requests within 24 hours and we have high efficient production, engineers and sales team.
3.Our quality is more guaranteed.
We control the quality from quartz lumps to quartz sand and then quartz products, we have better and stricter quality control than other manufactures.
4.We are able to produce more difficult quartz products.
We have large grinding platforms and precision etching machines which enable us to produce large sizes of quartz plates, tubes and high size precision quartz items.