T: +86-518-85528012
E: nick@luverrequartz.com
E: nick@luverrequartz.com
1st floor Runlian industrial center No. 116 QuFeng Rd., Haizhou Economic and technological development zone Lianyungang City, Jiangsu Province, China 222062
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2.2 Density transparent fused silica semiconductor wafer
2.2 Density transparent fused silica semiconductor wafer is a high-purity, low expansion coefficient quartz material with excellent optical and electrical properties, widely used in semiconductor manufacturing, optical devices and precision electronics.
LUVERRE quartz
99.99%
Inner with Vacuum PVC bag and then wrapped with air bubble film, outer with wooden box.
as per customer's requirement
In today's rapidly developing field of science and technology, the performance and quality of semiconductor materials are directly related to the stability and reliability of electronic devices. 2.2 Density transparent fused silica semiconductor wafers, as a high-performance material, have a wide range of applications in the fields of precision optics, semiconductor manufacturing, laser technology and microelectronics.
Material properties
Highly transparent: Fused silica has an extremely high light transmittance, especially in the ultraviolet region, which makes it the material of choice for precision optical components and high-power laser systems.
Thermal stability: This material has an extremely low coefficient of thermal expansion, allowing it to remain dimensionally stable in high-temperature environments, which is essential for devices that need to operate under extreme conditions.
Chemical inertness: Fused silica hardly reacts with any chemicals, except hydrofluoric acid, which guarantees its long-term use in a variety of environments.
Mechanical strength: Although fused silica is a brittle material, it can achieve high mechanical strength after special treatment and is suitable for various processing techniques.
Electrical insulation: As an excellent electrical insulator, fused silica performs well in high-frequency applications, effectively preventing current leakage and improving circuit safety.
Manufacturing process
2.2 The production process of density transparent fused silica semiconductor wafers uses melt lifting technology, which minimizes internal defects and impurity content, resulting in higher purity and fewer bubbles. In addition, by precisely controlling the cooling rate, the microstructure of the wafer can be further optimized and its physical and chemical properties can be improved.
Application field
Semiconductor industry: used as a substrate material for the manufacture of integrated circuits, solar cells, etc.
- Precision optics: used to make optical components such as lenses, prisms, and window panels.
Laser technology: used as a transmission medium or focusing element in high-power lasers.
Scientific research: used as a container or sample stand in physical and chemical experiments.
Medical equipment: used to make key components in medical imaging devices such as endoscopes and microscopes.
Customer support and service
We provide comprehensive technical support, including but not limited to product selection guidance, application solution design, and after-sales maintenance services. For specific needs, we can also customize production according to customer requirements to ensure that each customer's unique needs are met.
2.2 density transparent fused silica semiconductor wafers have become one of the materials of choice in many high-tech fields due to their outstanding performance and reliable quality. Whether you are looking for a standard specification product or require a specially tailored solution, we are here to serve you.
In today's rapidly developing field of science and technology, the performance and quality of semiconductor materials are directly related to the stability and reliability of electronic devices. 2.2 Density transparent fused silica semiconductor wafers, as a high-performance material, have a wide range of applications in the fields of precision optics, semiconductor manufacturing, laser technology and microelectronics.
Material properties
Highly transparent: Fused silica has an extremely high light transmittance, especially in the ultraviolet region, which makes it the material of choice for precision optical components and high-power laser systems.
Thermal stability: This material has an extremely low coefficient of thermal expansion, allowing it to remain dimensionally stable in high-temperature environments, which is essential for devices that need to operate under extreme conditions.
Chemical inertness: Fused silica hardly reacts with any chemicals, except hydrofluoric acid, which guarantees its long-term use in a variety of environments.
Mechanical strength: Although fused silica is a brittle material, it can achieve high mechanical strength after special treatment and is suitable for various processing techniques.
Electrical insulation: As an excellent electrical insulator, fused silica performs well in high-frequency applications, effectively preventing current leakage and improving circuit safety.
Manufacturing process
2.2 The production process of density transparent fused silica semiconductor wafers uses melt lifting technology, which minimizes internal defects and impurity content, resulting in higher purity and fewer bubbles. In addition, by precisely controlling the cooling rate, the microstructure of the wafer can be further optimized and its physical and chemical properties can be improved.
Application field
Semiconductor industry: used as a substrate material for the manufacture of integrated circuits, solar cells, etc.
- Precision optics: used to make optical components such as lenses, prisms, and window panels.
Laser technology: used as a transmission medium or focusing element in high-power lasers.
Scientific research: used as a container or sample stand in physical and chemical experiments.
Medical equipment: used to make key components in medical imaging devices such as endoscopes and microscopes.
Customer support and service
We provide comprehensive technical support, including but not limited to product selection guidance, application solution design, and after-sales maintenance services. For specific needs, we can also customize production according to customer requirements to ensure that each customer's unique needs are met.
2.2 density transparent fused silica semiconductor wafers have become one of the materials of choice in many high-tech fields due to their outstanding performance and reliable quality. Whether you are looking for a standard specification product or require a specially tailored solution, we are here to serve you.
