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E: nick@luverrequartz.com
E: nick@luverrequartz.com
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0.1-10 mm semiconductor fused wafer quartz glass plate
0.1-10 mm thick semiconductor fused wafer quartz glass plate is a special type of industrial glass made mainly of silica. This material is widely used in the semiconductor industry due to its unique physical and chemical properties.
LUVERRE quartz
99.99%
Inner with Vacuum PVC bag and then wrapped with air bubble film, outer with wooden box.
as per customer's requirement
0.1-10 mm thick semiconductor fused wafer quartz glass plate is a special type of industrial glass made mainly of silica. This material is widely used in the semiconductor industry due to its unique physical and chemical properties.
The characteristics of quartz glass include:
High temperature resistance: Fused silica glass has a softening point of about 1730 ° C and can operate at temperatures between 1100 ° C and 1250 ° C for a long time, even reaching 1450 ° C in a short time.
Corrosion resistance: In addition to being sensitive to hydrofluoric acid, quartz glass has good corrosion resistance to other acids, and its acid resistance is 30 times that of ceramics and 150 times that of stainless steel.
Thermal stability: Quartz glass has a very small coefficient of thermal expansion and can withstand severe temperature changes, such as being placed directly from high temperature into room temperature water without cracking.
High light transmittance: Quartz glass has good transmittance in the entire spectral range from ultraviolet to infrared, with a transmittance of more than 95% for visible light, especially in the ultraviolet band, where the maximum transmittance exceeds 85%.
Electrical insulation: The resistance value of quartz glass is 10,000 times that of ordinary glass, making it an excellent electrical insulating material that maintains good electrical properties even at high temperatures.
These properties of quartz glass make it an important material for the semiconductor industry, where it is used to make bulk processing equipment and single-wafer processing equipment. In the semiconductor industry, quartz glass is used to make quartz boats, quartz bases, quartz carriers, etc., as well as liners, valve plates, spray plates, wafer carriers, and sensors for single-wafer processing equipment.
0.1-10 mm thick semiconductor fused wafer quartz glass plate is a special type of industrial glass made mainly of silica. This material is widely used in the semiconductor industry due to its unique physical and chemical properties.
The characteristics of quartz glass include:
High temperature resistance: Fused silica glass has a softening point of about 1730 ° C and can operate at temperatures between 1100 ° C and 1250 ° C for a long time, even reaching 1450 ° C in a short time.
Corrosion resistance: In addition to being sensitive to hydrofluoric acid, quartz glass has good corrosion resistance to other acids, and its acid resistance is 30 times that of ceramics and 150 times that of stainless steel.
Thermal stability: Quartz glass has a very small coefficient of thermal expansion and can withstand severe temperature changes, such as being placed directly from high temperature into room temperature water without cracking.
High light transmittance: Quartz glass has good transmittance in the entire spectral range from ultraviolet to infrared, with a transmittance of more than 95% for visible light, especially in the ultraviolet band, where the maximum transmittance exceeds 85%.
Electrical insulation: The resistance value of quartz glass is 10,000 times that of ordinary glass, making it an excellent electrical insulating material that maintains good electrical properties even at high temperatures.
These properties of quartz glass make it an important material for the semiconductor industry, where it is used to make bulk processing equipment and single-wafer processing equipment. In the semiconductor industry, quartz glass is used to make quartz boats, quartz bases, quartz carriers, etc., as well as liners, valve plates, spray plates, wafer carriers, and sensors for single-wafer processing equipment.
